Esp32 s3 mini

$15.00

ESP32‑S3 Mini: Ultra‑Compact Dual‑Core 802.11 & BLE MCU for High‑Performance IoT The ESP32 S3 Mini is a premium microcontroller board built around the ESP32‑S3 SoC, delivering dual‑core Xtensa LX7 processing at 240 MHz, 2 MB of embedded PSRAM, and up to 4 MB of external flash. Its footprint (≈21 × 30 mm) and low‑profile connectors make it ideal for space‑constrained smart devices, while a built‑in USB‑C to USB‑B interface simplifies prototyping and firmware updates. Combining Wi‑Fi 802.11b/g/n and Bluetooth LE 5.0 in a single silicon die, the Mini offers high‑throughput, low‑latency communication paired with robust peripheral support – 48 GPIOs, 18‑bit SAR‑ADC, 2‑channel DAC, multiple UARTs, I²C, SPI, PWM,…

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Description

ESP32‑S3 Mini: Ultra‑Compact Dual‑Core 802.11 & BLE MCU for High‑Performance IoT

The ESP32 S3 Mini is a premium microcontroller board built around the ESP32‑S3 SoC, delivering dual‑core Xtensa LX7 processing at 240 MHz, 2 MB of embedded PSRAM, and up to 4 MB of external flash. Its footprint (≈21 × 30 mm) and low‑profile connectors make it ideal for space‑constrained smart devices, while a built‑in USB‑C to USB‑B interface simplifies prototyping and firmware updates.

Combining Wi‑Fi 802.11b/g/n and Bluetooth LE 5.0 in a single silicon die, the Mini offers high‑throughput, low‑latency communication paired with robust peripheral support – 48 GPIOs, 18‑bit SAR‑ADC, 2‑channel DAC, multiple UARTs, I²C, SPI, PWM, and touch‑capable pins. The board’s low‑power modes (U0, U1, U2, U3) enable sub‑milliamp operation in deep sleep, making it a perfect fit for battery‑powered IoT deployments.

  • Processor: 2‑core Xtensa LX7, 240 MHz
  • Memory: 2 MB PSRAM, up to 4 MB external flash
  • Connectivity: 802.11b/g/n Wi‑Fi, Bluetooth LE 5.0
  • Common Use Case: Embedded edge devices, wireless sensor nodes, and rapid‑prototype IoT hubs

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